Tra-Con Tra-Bond 933-1 Moisture Resistant Chip Encapsulant

Seller in Philadelphia price: $1447 per MT

Tra-Con Tra-Bond 933-1 Moisture Resistant Chip Encapsulant in Polymer, Thermoset, Epoxy, Filled/Reinforced Thermoset

  • Physical Properties
  • Specific Gravity
  • 2.10 g/cc
  • Water Absorption
  • 0.11 %
  • Viscosity
  • 360500 cP @Temperature 25.0 °C

  • Mechanical Properties
  • Hardness, Shore D
  • 92
  • Adhesive Bond Strength
  • 17.2 MPa

  • Thermal Properties
  • CTE, linear
  • 30.0 µm/m-°C
  • CTE, linear
  • 100 µm/m-°C
  • Thermal Conductivity
  • 1.00 W/m-K @Temperature 121 °C
  • Maximum Service Temperature, Air
  • 150 °C
  • Minimum Service Temperature, Air
  • -60.0 °C
  • Glass Transition Temp, Tg
  • 124 °C

  • Electrical Properties
  • Volume Resistivity
  • 1.00e+16 ohm-cm @Temperature 100 °C
  • Dielectric Constant
  • 6.1
  • Dielectric Strength
  • 39.4 kV/mm
  • Dissipation Factor
  • 0.0070

  • Chemical Properties
  • Ionic Impurities - Na (Sodium)
  • 55 ppm
  • Ionic Impurities - Cl (Chloride)
  • 300 ppm

  • Processing Properties
  • Cure Time
  • 30.0 min @Temperature 150 °C
  • Cure Time
  • 120 min @Temperature 125 °C

  • Descriptive Properties
  • Color
  • Black
  • Water Extract Conductivity umhos/cm
  • 290
  • Weight Loss %
  • 0.67
  • Working Life, months
  • 2

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Andrey Kutuzov

University of Córdoba (Spain), email: [email protected]

1 prices for Tra-Con Tra-Bond 933-1 Moisture Resistant Chip Encapsulant

Seller from Philadelphia – 2021-07-23:

Seller from Philadelphia work with company: Solvay, RTP Company, SABIC Innovative Plastics (GE Plastics), ALIMEX GmbH

Price: $1447 per MT

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