Aptek DIS-A-PASTE 2310-PMF Thermally conductive adhesive/encapsulant price 1984 per MT

Physical Properties
Density
2.00 g/cc
Outgassing - Total Mass Loss
0.51 %
Collected Volatile Condensable Material
0.040 %

Mechanical Properties
Hardness, Shore A
85
Tensile Strength, Ultimate
2.41 MPa
Elongation at Break
70 %
Modulus of Elasticity
0.00448 GPa
Adhesive Bond Strength
2.07 MPa

Thermal Properties
CTE, linear
50.0 µm/m-°C @Temperature 20.0 °C
CTE, linear
160 µm/m-°C @Temperature 20.0 °C
Thermal Conductivity
1.38 W/m-K
Glass Transition Temp, Tg
-75.0 °C
Flash Point
>= 200 °C

Electrical Properties
Volume Resistivity
8.00e+15 ohm-cm
Dielectric Constant
4.6 @Frequency 1000 Hz
Dielectric Strength
14.2 kV/mm @Thickness 12.7 mm
Dissipation Factor
0.020 @Frequency 1000 Hz

Processing Properties
Processing Temperature
85.0 °C
Processing Temperature
100 °C
Processing Temperature
125 °C

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Andrey Kutuzov

University of Córdoba (Spain), email: [email protected]

Work with plastics from August, 2015

1 prices for Aptek DIS-A-PASTE 2310-PMF Thermally conductive adhesive/encapsulant

Seller from Madrid – 2021-07-22:

Seller from Madrid work with company: Solvay, SABIC Innovative Plastics (GE Plastics), BASF, ALIMEX GmbH

Price: $1984 per MT